Microstructural Development of Electrical Steels under Si and Al Diffusion

Article Preview

Abstract:

The effect of Si and Al diffusion from a coating in the microstructure of electrical steels have been investigated for three different processing routes. In general the final texture is not affected by the diffusion of Si or Al from the coating whereas the grain size and mor- phology can be affected if the silicon content of the substrate is low enough to allow phase transformation. The gamma to alpha phase transformation caused by the diffusion of Si and Al determines the grain size and morphology resulting in columnar grain growth. The evolu- tion of the microstructures during the diffusion annealing for the production of high Si steels shows some common features with the microstructure evolution during the grain growth in conventional low silicon (Si < 3 wt.%) electrical steels.

You might also be interested in these eBooks

Info:

Periodical:

Defect and Diffusion Forum (Volumes 258-260)

Pages:

39-45

Citation:

Online since:

October 2006

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2006 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] A. Moses: IEE Proceedings Vol. 137 (1990), p.233.

Google Scholar

[2] H. Haiji et al.: J. Magn. Mag. Mat. Vol. 160 (1996), p.109.

Google Scholar

[3] T. Ros, Y. Houbaert and V. Gomez: J. App. Phys. Vol. 91(10) (2002), p.7857.

Google Scholar

[4] R. Bozorth: Ferromagnetism, Ed. Van Nostrand (1951).

Google Scholar

[5] L. Kestens, J. Jonas, P. Van Houtte: Met. Mat. Trans. A Vol. 27(8) (1996), p.2347.

Google Scholar

[6] T. Tomida, S. Uenoya: ISIJ International Vol. 35(5) (1995), p.548.

Google Scholar

[7] J. Barros, B. Malengier, R. Van Keer, Y. Houbaert: J. Ph. Eq. Diff. Vol. 26(5) (2005), p.417.

Google Scholar

[8] J. Barros, T. Ros, Y. Houbaert: Defect and Diffusion Forum, Vol. 237-240 (2005), p.1150.

Google Scholar

[9] M. daCunha, S. Paolinelli: Mat. Sci. Forum Vols. 467-470 (2004), p.869.

Google Scholar

[10] J. Park, J. Szpunar: ISIJ International Vol. 43(10) (2003), p.1611.

Google Scholar