Study of Reaction Diffusivity in the Copper–Indium–Tin Ternary System

Abstract:

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Interaction of lead-free solders with copper substrate represents an important phenomenon in the issue of reliability of solder joints. New experimental data describing phase equilibria in the Cu-In-Sn system after long-time diffusion annealing at the 400 °C/50 hours, 600 °C/310 hours and 600 °C/48 hours will be presented. The composition of solders was: 100 % Sn, 75 % Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. The fast quenching method was employed to freeze thermodynamic equilibrium after annealing, followed by metallography, microhardness measurements, SEM (Scanning Electron Microscope) and WDX (Wave Dispersive X-ray) analysis. New phase equilibrium data, together with the data from literature, represent the best existing experimental description of phase equilibria in the system in question. The obtained experimental results of the phase equilibria were compared with the thermodynamic modelling by the CALPHAD (Calculation of Phase Diagrams) method and with other authors.

Info:

Periodical:

Edited by:

J. Čermák and I. Stloukal

Pages:

231-236

DOI:

10.4028/www.scientific.net/DDF.263.231

Citation:

J. Drápala et al., "Study of Reaction Diffusivity in the Copper–Indium–Tin Ternary System", Defect and Diffusion Forum, Vol. 263, pp. 231-236, 2007

Online since:

March 2007

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$35.00

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