Study of Reaction Diffusivity in the Copper–Indium–Tin Ternary System

Abstract:

Interaction of lead-free solders with copper substrate represents an important phenomenon in the issue of reliability of solder joints. New experimental data describing phase equilibria in the Cu-In-Sn system after long-time diffusion annealing at the 400 °C/50 hours, 600 °C/310 hours and 600 °C/48 hours will be presented. The composition of solders was: 100 % Sn, 75 % Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. The fast quenching method was employed to freeze thermodynamic equilibrium after annealing, followed by metallography, microhardness measurements, SEM (Scanning Electron Microscope) and WDX (Wave Dispersive X-ray) analysis. New phase equilibrium data, together with the data from literature, represent the best existing experimental description of phase equilibria in the system in question. The obtained experimental results of the phase equilibria were compared with the thermodynamic modelling by the CALPHAD (Calculation of Phase Diagrams) method and with other authors.

• Periodical: Defect and Diffusion Forum (Volume 263)
• Pages: 231-236
• DOI: https://doi.org/10.4028/www.scientific.net/DDF.263.231
• Online since: March 2007
• Authors: Jaromír Drápala, Petr Kubíček, J. Vřeštál, Monika Losertová
• Keywords: Copper (Cu), Indium, Moving Boundary Interface, Reaction Diffusivity, Stefan Problem, Ternary System, Titanium Nitride TiN

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