Early Stage of Solid State Interfacial Reaction between Copper and Tin

Abstract:

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High-purity plates of Cu and Sn were diffusion bonded to clarify the early stage of the solid state interfacial reaction between Cu and Sn, focusing on the incubation time for the formation of intermetallic compounds. A clear incubation time for the formation of intermetallic compounds is observed at every temperature between 423 and 493 K. The incubation time changes depending on the annealing temperature. The interface annealed at 423 K for 3.60 ks maintains the direct interconnection between Cu and Sn being free of intermetallic compounds. The exposure of Cu surface to air affects the interfacial reaction. Annealing of the Cu/Sn interface at 493 K for 3600 s starts to form voids by using the Cu plates exposed for 8.64×104 s or longer to air. Furthermore, the reaction product layer formed by the same annealing condition becomes thinner when the Cu plates exposed for 8.64×105 s or longer to air are used.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 283-286)

Edited by:

Andreas Öchsner, Graeme E. Murch and Ali Shokuhfar

Pages:

323-328

DOI:

10.4028/www.scientific.net/DDF.283-286.323

Citation:

M. Maeda et al., "Early Stage of Solid State Interfacial Reaction between Copper and Tin", Defect and Diffusion Forum, Vols. 283-286, pp. 323-328, 2009

Online since:

March 2009

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