Study of Semisolid and ECAP Processes on Al-Fe-Si Alloy - Microstructure and Kinetic Grain Growth

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Abstract:

ECAP (Equal Channel Angular Pressing) is one of the useful methods of Severe Plastic Deformation (SPD) to reach ultrafine grain size. ECAP was carried out on Al-Fe-Si alloy. All grains stretched along the ECAP direction. Samples were ECAPed for one pass into an ECAP mold with two equal channels (1 cm × 1 cm) with 90o between them. After ECAP, specimens were heat treated (semisolided) for different times and temperatures for achieving globular grains. Optical microscopy has been used to evaluate the microstructure. By ECAP and semisolid processes, the structure becomes fine and globular. The kinetic grain growth has been studied for this alloy by the calculation of the D = Ktn equation and log(D)-log(t) curves.

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Defect and Diffusion Forum (Volumes 312-315)

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166-171

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April 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] S. Hossein Nedjad, H. Meidani, M. Nili Ahmadabadi: Materials Science and Engineering A Vol. 475 (2008), p.224.

DOI: 10.1016/j.msea.2007.04.047

Google Scholar

[2] A. P. Zhilyaev, X. Cheng, M. Furukawa, Z. Horita, T. G. Langdon, Principles of H. P. T. and E. Ch. A. P.: A camparison of microstructural characteristics, 2004, Ultrafine Grained Materials, Edited by Y.T. Zhu et al., TMS, Warrendale, PA, 78-80.

Google Scholar

[3] K. Furuno, H. Akamatsu, K. Oh-ishi, M. Furukawa, Z. Horitaand, T.G. Langdon, Microstructural Developing in Equal-Channel Angular Pressing using a 60 Degrees Die, Faculty of Engineering, Kyushu University.

DOI: 10.1016/j.actamat.2004.01.040

Google Scholar

[4] J.R. Groza, J.F. Shackelford, E.J. Lavernia, M.T. Powers: Materials Processing Handbook, Taylor & Francis Group, NY, Chapter 13.

Google Scholar

[5] B.Q. Han, T.G. Langdon: Materials Science and Engineering A Vol, 410–411 (2005), p.435.

Google Scholar

[6] J. Jiang, Y. Wang, S. Luo: Materials Characterization Vol. 58 (2007), p.190.

Google Scholar

[7] S. Ashouri, M. Nili-Ahmadabadi, M. Moradi, M. Iranpour: Journal of Alloys and Compounds Vol. 466 (2008), p.67.

DOI: 10.1016/j.jallcom.2007.11.010

Google Scholar

[8] D. Liu, H.V. Atkinson, H. Jones, Proceedings of the 8th International Conference on Semisolid Proc. of Alloys and Composites, Cyprus, (2004).

Google Scholar

[9] H. Arami, R. Khalifehzadeh, H. Keyvan, F. Khomamizadeh: Journal of Alloys and Compounds Vol. 468 (2009), p.130.

Google Scholar

[10] Y. Sirong, L. Dongcheng, N. Kim: Materials Science and Engineering A Vol. 420 (2006) 165.

Google Scholar

[11] E. Tzimas, A. Zavaliang: Acta Materialia Vol. 47 (1999), p.517.

Google Scholar

[12] L. Sang-Yong, L. Jung-Hwan, L. Young-Seon: Material Processing Technology Vol. 111 (2001), p.42.

Google Scholar

[13] Y. Zhang, N. Ma, H. Yi, S. Li, H. Wang: Materials and Design Vol. 27 (2006), p.794.

Google Scholar