Reactive Diffusion at the Cylindrical Dissolving of Copper in the Solder Melt

Abstract:

Problems of reactive diffusion at the solid phase and melt contact were studied theoretically and experimentally. The main intention was to calculate the time course of the solid phase dissolving in the case of cylindrical dissolving. These calculations were carried out on the assumption for the rate constant of dissolving K = const. In our work we give heed especially to the dominating process, which is the solid metal A dissolved in the melt B. During the dissolving the melt B saturates with the metal A and the process is influenced by convections which are characteristic for the given experimental configuration. A theoretical description of the kinetics of the solid phase dissolving in the melt will be presented for the case of cylindrical dissolving. The aim is to derive a relation for the interface boundary movement c(t) in dependence on time and a time course of growth of the element A concentration in the melt B. There are problems with accurate determination of the interface boundary movement after certain heating times of specimens, when it is observed experimentally, since intermetallic phases create in the original A metal at both the diffusion and cooling and some phases segregate at the solidifying melt cooling. The main intention was an experimental study of the copper dissolving in the tin melt. Experiments aimed to the determination of the Cu wires (diameters from 0.5 to 3.5 mm) dissolution in the solder melt were carried out at various selected temperatures and times. Rapid growth of phases in the metal A and determination of the thickness of layers with these phases pose considerable time demands to X-ray micro-analyses (WDX, EDX) of specimens after their long-time heating.

• Periodical: Defect and Diffusion Forum (Volumes 312-315)
• Pages: 387-392
• DOI: https://doi.org/10.4028/www.scientific.net/DDF.312-315.387
• Online since: April 2011
• Authors: Jaromír Drápala, Alena Struhařová, Daniel Petlák, Vlastimil Vodárek, Petr Kubíček
• Keywords: Copper, Cylindrical Dissolving, Rate Constant, Reactive Diffusion, Solder Melt, TiN

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DOI: 10.4028/www.scientific.net/ddf.263.231

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