Modeling of Multi-Phase Solid State Reactions-Case of IMC Growth

M. Pawełkiewicz; Marek Danielewski; Jolanta Janczak-Rusch; Bartek Wierzba

doi:10.4028/www.scientific.net/DDF.323-325.127

Paper Titles

Multiscale Modelling of Morphological Evolution of Rough Surface during Superficial, Volume and Evaporation-Condensation Diffusions
p.101

Simulation of Metal/Oxide Interface Mobility: Effects of Mechanical Stresses on Geometrical Singularities
p.109

High Temperature Diffusion Processes at the Metal/Slag Interface
p.115

Modeling of Fractional Diffusion on a Catalytic Particle under Different Flow Conditions
p.121

Modeling of Multi-Phase Solid State Reactions-Case of IMC Growth
p.127

Fractal Dimension of Grain Boundary during Heating Comparison between Images Analyses and Monte Carlo Simulation
p.133

A Reactive Force Field Molecular Dynamics Simulation Study of Corrosion of Nickel
p.139

Structural Re-Organization Kinetics of Nanocrystalline Pt Films during In Situ Annealing
p.149

Determination of Grain Boundary Diffusion Parameters Based on Combined Analysis of Radiotracer Technique and Mössbauer Spectroscopy Data
p.155

HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 323-325Modeling of Multi-Phase Solid State Reactions-Case...

Modeling of Multi-Phase Solid State Reactions-Case of IMC Growth

Abstract:

The formation of intermetallic compounds (IMC) at the solder-substrate interface is required to initiate the metallurgical bond. However, rapid growth of IMCs may degrade joint strength through i) the increased presence of a low toughness phase, ii) the consumption of the solderable surface (void formation) and iii) generation of primary and secondary stresses. Knowledge of mass transport and reaction processes during joint formation and service life are essential for solder system design. The mathematical description of inter-and reactive diffusion in open system presented here is based on Darken method (bi-velocity), involving the different molar volumes in the system and Wagner boundary conditions. It combines the interdiffusion, reactive diffusion and the effective flux constraints to couple processes occurring at different time scales. The rCADiff software serves as a tool to simulate simultaneous growth of the two Cu-Sn IMCs.

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Defect and Diffusion Forum (Volumes 323-325)

Pages:

127-132

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.323-325.127

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Online since:

April 2012

Authors:

M. Pawełkiewicz, Marek Danielewski, Jolanta Janczak-Rusch, Bartek Wierzba

Keywords:

Bi-Velocity Method, Cu-Sn System, Intermetallic Phase, Reactive Diffusion

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