Thermal Expansion of Cu-Ga-Sn Alloys

V.A. Bykov; T.V. Kulikova; K.Yu. Shunyaev; A.B. Shubin

doi:10.4028/www.scientific.net/DDF.353.137

Paper Titles

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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 353Thermal Expansion of Cu-Ga-Sn Alloys

Thermal Expansion of Cu-Ga-Sn Alloys

Abstract:

The thermal and microstructural properties of five copper-gallium-tin alloys (Cu-Ga-Sn) and two important intermetallic compounds Cu₃Sn and CuGa₂ have been investigated by dilatometry, scanning electron microscopy (SEM) equipped with energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction. The temperature dependence of thermal expansion and coefficient of linear thermal expansion (CLTE) were obtained.

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Defect and Diffusion Forum (Volume 353)

Pages:

137-142

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.353.137

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Online since:

May 2014

Authors:

V.A. Bykov*, T.V. Kulikova, K.Yu. Shunyaev, A.B. Shubin

Keywords:

Cu-Ga-Sn Alloys, Solder, Thermal Expansion

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