Diffusion Controlled Grain Boundary and Triple Junction Wetting in Polycrystalline Solid Metal

Irina Apyhtina; Kseniia Kovaleva; Alexander Novikov; Darya Orelkina; Alexander Petelin; Egor Yakushko

doi:10.4028/www.scientific.net/DDF.363.127

Paper Titles

Theoretical Evaluation of Anisotropic Distortion Associated with Point Defects in Ordered Compounds
p.101

Effect of Purity on Dislocation-Induced Relaxations in Molybdenum Single Crystals
p.106

General Approach to Diffusion under a Stress in Metals and Interstitial Alloys
p.112

Numerical Modelling of Heterodiffusion from the Variable Type Source
p.120

Diffusion Controlled Grain Boundary and Triple Junction Wetting in Polycrystalline Solid Metal
p.127

Ni Grain Boundary Diffusion in Cu-Co Alloys
p.130

Ga Penetration along the Grain Boundaries of Aluminum Alloys
p.133

Ti and Ni Grain Boundary Diffusion in B2 NiTi Compound
p.137

The Model of the Layer Boundary Diffusion in Multilayer Materials
p.142

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Diffusion Controlled Grain Boundary and Triple Junction Wetting in Polycrystalline Solid Metal

Abstract:

Grain boundary liquid grooving process takes place during the contact of solid phase with the melt. The liquid bismuth network formation along grain boundaries (GBs) and triple junctions (TJs) was investigated in copper polycrystalline samples. The in situ experimental observation technique of Bi penetration through the Cu plate was used. The temperature dependencies of GB and TJ effective penetration depths were determined. The effect of the GB and TJ diffusion on the liquid channels growth mechanism was discussed.

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Periodical:

Defect and Diffusion Forum (Volume 363)

Pages:

127-129

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.363.127

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Online since:

May 2015

Authors:

Irina Apyhtina, Kseniia Kovaleva, Alexander Novikov*, Darya Orelkina, Alexander Petelin, Egor Yakushko

Keywords:

Bismuth, Copper, Grain Boundaries, Penetration, Wetting

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