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Thermophysical Properties of Cu-Based Subsystems of High-Entropy Alloys

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Abstract:

According to the well-known concept of multicomponent high-entropy alloys, high entropy of mixing can stabilize the formation of solid solutions (simple bcc or fcc crystal structure) during solidification. Stabilization of the solid solution and prevention of the formation of intermetallic phases during solidification is provided by the high entropy of mixing in the solid and liquid states. High-entropy alloys have increased strength, high hardness, thermal stability in combination with good resistance to oxidation and corrosion. These properties allow to significantly expand the scope of these alloys. In this work, the electrical resistivity, thermoelectric power and surface tension of binary Cu–Sn, Cu–Ga and Cu–Bi alloys, which are the sub-system components of model low-temperature high-entropy Bi–Cu–Ga–Pb–Sn alloys, have been studied in a wide temperature range including solid and liquid states. The lack of the surface tension data of the above-mentioned alloys is compensated by the model predicted values.

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Periodical:

Defect and Diffusion Forum (Volume 431)

Pages:

21-33

DOI:

https://doi.org/10.4028/p-gL7mcS

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Online since:

February 2024

Authors:

Yuriy Plevachuk*, Lyubov Romaka, Irena Janotova, Peter Svec, Dusan Janičkovič, Rada Novakovic, Viktor Poverzhuk

Keywords:

Electrical Resistivity, High Entropy Alloy, Microstructure, Thermoelectric Power, Thermophysical Properties

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