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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 95-98Computer Simulations and Models on...

Computer Simulations and Models on Electromigration in Al-Lines of Integrated Circuits

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Diffusion in Materials - DIMAT 1992

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Periodical:

Defect and Diffusion Forum (Volumes 95-98)

Pages:

263-264

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.95-98.263

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Cite this paper

Online since:

January 1993

Authors:

U. Kaeber, Reiner Kirchheim

Keywords:

Al Thin Film, Computer Simulation, Electromigration, Failure Criterion, Induced Stress

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Сopyright:

© 1993 Trans Tech Publications Ltd. All Rights Reserved

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