Morphological Control of Silicon Nanowire Arrays Formed by Metal-Assisted Chemical Etching Method

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Control of the orientation and length of silicon nanowire (SiNW) arrays has been achieved in large-scale single-crystalline SiNW arrays fabricated by a metal-assisted chemical etching technique. Well-aligned vertical and slanted SiNW arrays with ultra-high aspect ratios have been successfully fabricated, yielding nanowires with lengths of approximately 110 µm and diameters ranging from 100 to 200 nm after 75 minutes of etching. This formation is attributed to the selective etching of the silicon surface directly in contact with Ag particles via a microscale electrochemical cell consisting of a metal catalyst, Si substrate, and etchant solution. Moreover, the effects of etching parameters (AgNO3 concentration, etching time, and H2O2 concentration) and substrate properties (crystal orientation) on the as-prepared SiNWs have been systematically investigated. The results indicate that the morphology of the fabricated silicon nanostructures depends remarkably on AgNO3 concentration. The length of SiNWs shows a linear dependence on the etching time (0-1 h). Fast SiNW formation with a rate of 1.7 µm min-1 is achieved under optimized process conditions. However, the etching rate decreases slowly for long etching times (>1 h). Substrate properties have a direct relation to the SiNW orientation. By variation of the H2O2 concentration, inclined or vertical etching can be achieved on Si(111) substrates. SiNWs can be understood on the basis of the self-assembled localized microscopic electrochemical cell model. Finally, the optical properties of SiNWs etched in solutions with different concentrations of H2O2 have also been discussed.

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March 2026

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