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Investigation of Microstructure Evolution during AA6082 Chips Recycling through Friction Consolidation

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Abstract:

Recycling aluminum chips remains a major challenge in aluminum manufacturing because it is difficult to retain the original quality alloy properties while reducing the carbon footprint and ensuring a sustainable process. This work investigates the microstructural evolution and bonding quality of compacted AA6082 chips processed through friction extrusion/consolidation. The residual material left inside the extrusion container after processing at a high extrusion ratio was analyzed using SEM, EDS, and EBSD to understand bonding mechanisms and microstructure evolution in front of the die. The SEM results show that voids are still present between the chips in the initial compacted material which already shows bonding, while these voids are reducing towards the die interface, particularly related to the present severe plastic deformation. EDS analysis confirms the presence of Al (Fe,Mn)Si intermetallic particles, which break and disperse in the matrix because of shear deformation due to die rotation. EBSD analysis reveals that grains are coarser near the base material, and subdivisions of grains near the die interface are significant because of continuous dynamic recrystallization.

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Periodical:

Key Engineering Materials (Volume 1051)

Pages:

41-48

DOI:

https://doi.org/10.4028/p-Xv47nM

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Cite this paper

Online since:

April 2026

Authors:

Usman Aziz, Uceu F.H. Suhuddin*, Lars Rath, Léon F. Schröder, Volker Schmidt, Benjamin Klusemann

Keywords:

AA6082, Bonding and Microstructure, Friction Consolidation, Friction Extrusion, Recycling

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Creative Commons CC BY 4.0

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* - Corresponding Author

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