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Grain Boundary Structures in Electronic Ceramics
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Valence States of MgO, AI₂O₃ and Metal-Oxide Interfaces
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Ceramic Micropackages Realised through the Technology. Specific to Electronic Components
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Effect of NiO on the Sintering Behaviour of BaTiO₃
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Dielectric Properties of NiO-Doped BaTiO₃ sintered with different Oxygen Partial Pressure
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 132-136Ceramic Micropackages Realised through the...

Ceramic Micropackages Realised through the Technology. Specific to Electronic Components

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Euro Ceramics V

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Periodical:

Key Engineering Materials (Volumes 132-136)

Pages:

1163-1166

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.132-136.1163

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Online since:

April 1997

Authors:

Cornel Anton, Virginia Burghelea, Ioana Anton

Keywords:

Ceramic Micropackages

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© 1997 Trans Tech Publications Ltd. All Rights Reserved

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