Ceramic Micropackages Realised through the Technology. Specific to Electronic Components

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Periodical:

Key Engineering Materials (Volumes 132-136)

Main Theme:

Edited by:

P. Abelard, J. Baxter, D. Bortzmeyer et al.

Pages:

1163-1166

DOI:

10.4028/www.scientific.net/KEM.132-136.1163

Citation:

C. Anton et al., "Ceramic Micropackages Realised through the Technology. Specific to Electronic Components", Key Engineering Materials, Vols. 132-136, pp. 1163-1166, 1997

Online since:

April 1997

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$35.00

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