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HomeKey Engineering MaterialsKey Engineering Materials Vols. 145-149Thermal Stress Analysis of a PQFP Moulding...

Thermal Stress Analysis of a PQFP Moulding Process: Comparison of Viscoelastic and Elastic Models

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Fracture and Strength of Solids III

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Periodical:

Key Engineering Materials (Volumes 145-149)

Pages:

1127-1132

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.145-149.1127

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Online since:

October 1997

Authors:

Ju Hoon Park, Jang Kyo Kim, M.M.F. Yuen, S.W.R. Lee, Pin Tong, P.C.H. Chan

Keywords:

Failure Mechanics, Finite Element Analysis (FEA), PQFP, Residual Thermal Stresses, Viscoelastic Moulding Compound

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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