Effects of Temperature Profile on the Life Prediction of PBGA Solder Joints under Thermal Cycling

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Periodical:

Key Engineering Materials (Volumes 145-149)

Edited by:

P. Tong, T.Y. Zhang and J.K. Kim

Pages:

1133-1138

DOI:

10.4028/www.scientific.net/KEM.145-149.1133

Citation:

X.W. Zhang and S.W.R. Lee, "Effects of Temperature Profile on the Life Prediction of PBGA Solder Joints under Thermal Cycling", Key Engineering Materials, Vols. 145-149, pp. 1133-1138, 1998

Online since:

October 1997

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$35.00

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