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Effects of Temperature Profile on the Life Prediction of PBGA Solder Joints under Thermal Cycling
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Detection and Characterization of Cracks and Corrosion in Aging Aircraft Structures (Part 1)
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Detection and Characterization of Cracks and Corrosion in Aging Aircraft Structures (Part 2)
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 145-149Effects of Temperature Profile on the Life...

Effects of Temperature Profile on the Life Prediction of PBGA Solder Joints under Thermal Cycling

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Fracture and Strength of Solids III

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Periodical:

Key Engineering Materials (Volumes 145-149)

Pages:

1133-1138

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.145-149.1133

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Online since:

October 1997

Authors:

X.W. Zhang, S.W.R. Lee

Keywords:

Plastic Ball Grid Array, Solder Joint Reliability, Steady State Creep, Thermal Fatigue Life Prediction

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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