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HomeKey Engineering MaterialsKey Engineering Materials Vols. 145-149Evaluation of Fatigue Life in Microelectronics...

Evaluation of Fatigue Life in Microelectronics Solder Joints of a Surface-Mounted Type

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Fracture and Strength of Solids III

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Periodical:

Key Engineering Materials (Volumes 145-149)

Pages:

681-686

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.145-149.681

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Online since:

October 1997

Authors:

K. Kaminishi, M. Iino, M. Taneda

Keywords:

Fatigue Crack Extension, Fatigue Crack Initiation, Finite Element Model (FEM), Joint of Surface-Mounted Type, Solder

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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