Evaluation of Fatigue Life in Microelectronics Solder Joints of a Surface-Mounted Type

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Periodical:

Key Engineering Materials (Volumes 145-149)

Edited by:

P. Tong, T.Y. Zhang and J.K. Kim

Pages:

681-686

DOI:

10.4028/www.scientific.net/KEM.145-149.681

Citation:

K. Kaminishi et al., "Evaluation of Fatigue Life in Microelectronics Solder Joints of a Surface-Mounted Type", Key Engineering Materials, Vols. 145-149, pp. 681-686, 1998

Online since:

October 1997

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$35.00

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