Paper Titles

A New Era of Grain Boundary Design and Control for High Temperature Materials
p.237

Modelling the High Temperature Creep Behaviour of a New Single Crystal Nickel Base Superalloy
p.245

Orientation Dependent Creep Behavior and Dislocation Structure of Nickel Solid Solution Single Crystals
p.253

Threshold Stress for High-Temperature Deformation of Dispersion-Strengthened Alloys with Incoherent Dispersoids
p.261

High-Temperature Deformation of Cu-SiO₂ Bicrystals with [011] Twist Boundaries
p.269

Kinetic Modelling of the Influence of Particles on Creep Strength
p.277

Dislocation Activity in Plastically-Accommodated Creep in an Inclusion Bearing Material
p.285

Lattice-Diffusion Creep Mechanism Not Based on Stress Heterogeneity (2)
p.291

Effect of Dislocations Substructure on Creep Behavior of Steels Strengthened by Fine Carbides
p.297

HomeKey Engineering MaterialsKey Engineering Materials Vols. 171-174High-Temperature Deformation of Cu-SiO2 Bicrystals...

High-Temperature Deformation of Cu-SiO₂ Bicrystals with [011] Twist Boundaries

Article Preview

Abstract:

You might also be interested in these eBooks

Creep and Fracture of Engineering Materials and Structures

Info:

Periodical:

Key Engineering Materials (Volumes 171-174)

Pages:

269-276

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.171-174.269

Citation:

Cite this paper

Online since:

October 1999

Authors:

Hiromi Miura, K. Saijo, Taku Sakai

Keywords:

Cu-SiO₂ Bicrystal, Grain Boundary Energy, Grain Boundary Fracture, Grain Boundary Sliding (GBS), High Temperature Deformation

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2000 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: