Creep and Fracture of Engineering Materials and Structures

Creep and Fracture of Engineering Materials and Structures

Description:

Volume is indexed by Thomson Reuters CPCI-S (WoS).
Recent research on the creep and fracture of engineering materials is presented, with particular emphasis being placed on: mechanisms of high-temperature deformation and fracture, materials for high-temperature service, the behavior of single and polycrystals, components and structures, grain boundaries and interfaces, and superplasticity.

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Info:

Editors:
T. Sakuma, K. Yagi
THEMA:
TGM
BISAC:
TEC021000
Details:
Proceedings of the 8th International Conference on Creep and Fracture of Engineering Materials and Structures, held in Tsukuba, Japan, November 1-5, 1999
Pages:
888
Year:
2000
ISBN-13:
9780878498420
ISBN-13 (CD):
9783038596967
ISBN-13 (eBook):
9783035703818
Permissions CCC:
Permissions PLS:
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Review from Ringgold Inc., ProtoView: Mechanisms of high-temperature deformation and fracture, materials for high-temperature service, the behavior of single and polycrystals, components and structures, grain boundaries and interfaces, and superplasticity are among the highlights of the 80 or so papers. The topics include recent results of a long-term creep rupture test, creep crack growth in nearly full-lamellar gamma titanium-aluminum alloys, researching the welding effect on the creep damage of high-temperature furnace tubes, the kinetic modelling of the influence of particles, lattice-diffusion creep mechanisms not based on stress heterogeneity, microstructural aspects of the creep behavior of advanced power plants steels, deformation mechanisms in tin and tin-based electronic solder alloys, and the creep behavior of a fine-grained tetragonal zirconia. The papers are reproduced from typescripts.