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HomeKey Engineering MaterialsKey Engineering Materials Vols. 171-174Microstructural Evolution Associated with Creep...

Microstructural Evolution Associated with Creep Rate Minima in Pure- and Near-γ TiAl Intermetallics

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Creep and Fracture of Engineering Materials and Structures

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Periodical:

Key Engineering Materials (Volumes 171-174)

Pages:

693-700

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.171-174.693

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Online since:

October 1999

Authors:

Antonín Dlouhý, K. Kuchařová, T. Horkel

Keywords:

Twinning, Creep, Intermetallic, Microstructural Evolution, TEM, TiAl

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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