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HomeKey Engineering MaterialsKey Engineering Materials Vols. 171-174Effect of Microalloying on the Creep Strength and...

Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders

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Creep and Fracture of Engineering Materials and Structures

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Periodical:

Key Engineering Materials (Volumes 171-174)

Pages:

663-668

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.171-174.663

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Online since:

October 1999

Authors:

Noboru Wade, T. Akuzawa, J. Kunii, K. Miyahara

Keywords:

Creep, Microalloyed, Microstructure, Particle Dispersion Strengthening, Rupture Strength, Sn-Pb Eutectic Alloy, Solder, Strength

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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