Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders

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Periodical:

Key Engineering Materials (Volumes 171-174)

Edited by:

T. Sakuma, K. Yagi

Pages:

663-668

DOI:

10.4028/www.scientific.net/KEM.171-174.663

Citation:

N. Wade et al., "Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders", Key Engineering Materials, Vols. 171-174, pp. 663-668, 2000

Online since:

October 1999

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$35.00

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