Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys

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Periodical:

Key Engineering Materials (Volumes 171-174)

Edited by:

T. Sakuma, K. Yagi

Pages:

655-662

DOI:

10.4028/www.scientific.net/KEM.171-174.655

Citation:

M.D. Mathew et al., "Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys", Key Engineering Materials, Vols. 171-174, pp. 655-662, 2000

Online since:

October 1999

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$35.00

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