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HomeKey Engineering MaterialsKey Engineering Materials Vols. 171-174Deformation Mechanisms in Tin and Tin-Based...

Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys

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Creep and Fracture of Engineering Materials and Structures

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Periodical:

Key Engineering Materials (Volumes 171-174)

Pages:

655-662

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.171-174.655

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Online since:

October 1999

Authors:

M.D. Mathew, S. Movva, K.Linga Murty

Keywords:

Activation Energy, Creep, Sn-3.5Ag, Sn-5Sb, Solder, Titanium Nitride TiN

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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