Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits

Abstract:

Article Preview

Info:

Periodical:

Key Engineering Materials (Volumes 171-174)

Edited by:

T. Sakuma, K. Yagi

Pages:

633-638

DOI:

10.4028/www.scientific.net/KEM.171-174.633

Citation:

Q. Zhou and G. Itoh, "Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits", Key Engineering Materials, Vols. 171-174, pp. 633-638, 2000

Online since:

October 1999

Authors:

Export:

Price:

$35.00

In order to see related information, you need to Login.