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HomeKey Engineering MaterialsKey Engineering Materials Vols. 171-174Creep Behavior of Aluminum Alloy Foils for...

Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits

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Creep and Fracture of Engineering Materials and Structures

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Periodical:

Key Engineering Materials (Volumes 171-174)

Pages:

633-638

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.171-174.633

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Online since:

October 1999

Authors:

Qing Zhou, Goroh Itoh

Keywords:

Subgrains, Al-1%Si-0.5%Cu Alloy, Grain Size, Microelectronic Circuit, Texture, Thickness, Thin Foil

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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