Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits

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Periodical:

Key Engineering Materials (Volumes 171-174)

Edited by:

T. Sakuma, K. Yagi

Pages:

633-638

Citation:

Q. Zhou and G. Itoh, "Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits", Key Engineering Materials, Vols. 171-174, pp. 633-638, 2000

Online since:

October 1999

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$38.00

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