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HomeKey Engineering MaterialsKey Engineering Materials Vols. 206-213Influence of AlN Intergranular Phases on Wetting...

Influence of AlN Intergranular Phases on Wetting and Bonding between Copper and Aluminum Nitride

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Euro Ceramics VII

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Periodical:

Key Engineering Materials (Volumes 206-213)

Pages:

555-558

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.206-213.555

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Online since:

December 2001

Authors:

Thierry Joyeux, Jean Jarrige, J.C. Labbe, J.P. Lecompte

Keywords:

Aluminum Nitride (AlN), Copper (Cu), Direct Bonding Copper DBC, Joining, Thermal Diffusivity, Wettability, YAG, YAM, YAP, Yttrium Aluminate

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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