Wettability of SiC/Liquid Cu with Ti Additive System

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Periodical:

Key Engineering Materials (Volumes 224-226)

Edited by:

Jianghong Gong and Wei Pan

Pages:

749-754

Citation:

S. J. Li et al., "Wettability of SiC/Liquid Cu with Ti Additive System", Key Engineering Materials, Vols. 224-226, pp. 749-754, 2002

Online since:

June 2002

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