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HomeKey Engineering MaterialsKey Engineering Materials Vols. 224-226Wettability of SiC/Liquid Cu with Ti Additive...

Wettability of SiC/Liquid Cu with Ti Additive System

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High-Performance Ceramics 2001

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Periodical:

Key Engineering Materials (Volumes 224-226)

Pages:

749-754

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.224-226.749

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Online since:

June 2002

Authors:

Shu Jie Li, Xiao Ming Zang, Hui Ping Duan

Keywords:

Contact Angle (CA), Interface, Interfacial Reaction, Wettability

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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