Paper Titles

Application, Development and Prospects of After-Treatment Technology in Conventional Abrasive Materials
p.735

Kinetics of Carbon Monoxide Decomposition in Refractories
p.739

Analysis of the Aluminothermic Reaction Process
p.745

Wettability of SiC/Liquid Cu with Ti Additive System
p.749

Bonding Al on Al₂O₃ Substrate
p.755

Taking into Account the Variation of Fracture Mechanisms for Modelling the Toughness of Porous Sintered Glass
p.759

Fracture from Knoop Indentation-Induced Flaws in Sintered Silicon Carbide and Hot-Pressed Silicon Nitride
p.765

The Dynamic Fatigue Behavior of Si₃N₄ at Different Temperatures
p.771

On the Static Fatigue Test Results of Silicon Nitride Ceramics
p.775

HomeKey Engineering MaterialsKey Engineering Materials Vols. 224-226Bonding Al on Al2O3 Substrate

Bonding Al on Al₂O₃ Substrate

Article Preview

Abstract:

You might also be interested in these eBooks

High-Performance Ceramics 2001

Info:

Periodical:

Key Engineering Materials (Volumes 224-226)

Pages:

755-758

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.224-226.755

Citation:

Cite this paper

Online since:

June 2002

Authors:

Rong Peng, He Ping Zhou, Xiao Shan Ning, Yuan Bo Lin, Xu Wei

Keywords:

Al₂O₃ Substrate, Aluminum (Al), Bonding, Die-Casting-Bonding

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2002 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: