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HomeKey Engineering MaterialsKey Engineering Materials Vol. 227Interfacial Microstructure of Solid-State...

Interfacial Microstructure of Solid-State Diffusion Bonded Inconel Alloy 718

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Periodical:

Key Engineering Materials (Volume 227)

Pages:

223-228

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.227.223

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Online since:

August 2002

Authors:

G.G. Zhang, R.S. Chandel, H.P. Seow, H.H. Hng

Keywords:

Alloy 718, Diffusion Bonding (DB), Microstructure, Nickel-Based Superalloy, Solid-State

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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