Popcorn Failure and Unstable Void Growth in Plastic Electronic Packages

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Edited by:

C.-h. Chiu, Z. Chen, H. Gao, K.Y. Lam, A.A.O. Tay

Pages:

61-66

DOI:

10.4028/www.scientific.net/KEM.227.61

Citation:

C.W. Chong et al., "Popcorn Failure and Unstable Void Growth in Plastic Electronic Packages", Key Engineering Materials, Vol. 227, pp. 61-66, 2002

Online since:

August 2002

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$35.00

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