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HomeKey Engineering MaterialsKey Engineering Materials Vol. 227Novel Methods to Measure Residual Stresses in Thin...

Novel Methods to Measure Residual Stresses in Thin Films

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Modeling of Materials

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Periodical:

Key Engineering Materials (Volume 227)

Pages:

31-40

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.227.31

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Online since:

August 2002

Authors:

Tong Yi Zhang

Keywords:

Indentation Fracture Tests, Microbridge Tests, Micro-Rotating-Structures, Residual Stress, Thin Film

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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