Simulation of Polymer Removal from a Powder Injection Molding Compact by Thermal Debinding

Abstract:

Article Preview

Info:

Periodical:

Main Theme:

Edited by:

C.-h. Chiu, Z. Chen, H. Gao, K.Y. Lam, A.A.O. Tay

Pages:

1-6

DOI:

10.4028/www.scientific.net/KEM.227.1

Citation:

S. Ying et al., "Simulation of Polymer Removal from a Powder Injection Molding Compact by Thermal Debinding", Key Engineering Materials, Vol. 227, pp. 1-6, 2002

Online since:

August 2002

Export:

Price:

$35.00

In order to see related information, you need to Login.