High-Temperature Stability of a Nanostructured Cu-Al2O3 Alloy

M.T. Marques; Jose Brito Correia; J.M. Criado; M.J. Diánez; P. Matteazzi

doi:10.4028/www.scientific.net/KEM.230-232.652

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Structural and Thermal Behaviour of a W-Ti-N Sputtered Film after Thermal Annealing
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Mechanical Alloying of Fe-Cu Alloys from As-Received and Premilled Elemental Powder Mixtures
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Improving the Cutting Performance of TiAlN Coatings Using Submicron Metal Interlayers
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Influence of Heat Treatment on the Structure of W-Si-N Sputtered Films
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Physical and Spectroscopic Characterisation of Active Nanocrystals in Erbium-Doped Silica-Titania Sol-Gel Films
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Two-Dimensional Clusters of Bubbles
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High-Temperature Stability of a Nanostructured Cu-Al₂O₃ Alloy
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Nanocomposites: a State-of-the-Art Review
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 230-232High-Temperature Stability of a Nanostructured...

High-Temperature Stability of a Nanostructured Cu-Al₂O₃ Alloy

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Periodical:

Key Engineering Materials (Volumes 230-232)

Pages:

652-655

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.230-232.652

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Online since:

October 2002

Authors:

M.T. Marques, Jose Brito Correia, J.M. Criado, M.J. Diánez, P. Matteazzi

Keywords:

Hot Extrusion, Nanostructured Copper Alloys, Thermal Stability

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References

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