A Novel FEA Model for the Integral Analysis of a Machine Tool and Machining Processes

D. Huo; K. Cheng; D. Webb; F. Wardle

doi:10.4028/www.scientific.net/KEM.257-258.45

Paper Titles

Molecular Dynamics Analysis of Ultra High-Acceleration and Vibration Cutting
p.21

Abrasive Nanometric Machining: Modelling, Simulation and its Application Promise
p.27

A Study of the Molecular Dynamics Simulation in Nanometric Grinding
p.33

Measurement and Analysis of AFM-Based Nano-Indentation on Micro-Machined Silicon Surface
p.39

A Novel FEA Model for the Integral Analysis of a Machine Tool and Machining Processes
p.45

Influence of the Static Stiffness of Grinding System on the Generation of Affected Layers
p.51

Geometric Models of the Ultra-Precision Grinding for Large Non-Axisymmetric Optical Aspheric Surfaces
p.57

Energy Limitations in HEDG and Conventional Grinding
p.63

Performance of the Speed-Stroke and Creep-Feed Grinding under Constant Removal Rate
p.69

HomeKey Engineering MaterialsKey Engineering Materials Vols. 257-258A Novel FEA Model for the Integral Analysis of a...

A Novel FEA Model for the Integral Analysis of a Machine Tool and Machining Processes

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Key Engineering Materials (Volumes 257-258)

Pages:

45-50

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https://doi.org/10.4028/www.scientific.net/KEM.257-258.45

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Online since:

February 2004

Authors:

D. Huo, K. Cheng, D. Webb, F. Wardle

Keywords:

Finite Element Analysis (FEA), Machine Tool, Machining Processes, Thermal Deformation

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