Simulation of the System Silicon Substrate-Thin CBN Film

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Periodical:

Key Engineering Materials (Volumes 259-260)

Edited by:

Xipeng Xu

Pages:

101-105

Citation:

F. Xie et al., "Simulation of the System Silicon Substrate-Thin CBN Film ", Key Engineering Materials, Vols. 259-260, pp. 101-105, 2004

Online since:

March 2004

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$38.00

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[2] L. Achim, R. Hippler, S. Pfan, M. Schmidt and K.H. Schoenbach (Eds): Low Temperature Plasma Physics (WILEY-VCH, Berlin 2001).

[3] O. Madelung, M. Schulz and H. Weiss: Semiconductors (Springer-Verlag, Heidelberg 1982).

[4] ANSYS, Version 5. 5 Documentation (ANSYS Inc., Southpointe 1998).

[5] J.H. Lau: Thermal Stress and Strain in Microelectronics Packaging (VAN NOSTRAND REINHOLD, New York 1993).

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