Approach of Realizing Material Removal at Nanometer Level in Ultraprecision Polishing

X. Shen; M. Chang; Ju Long Yuan; Ping Zhao; Wen Hong Zhao; L.B. Zhang

doi:10.4028/www.scientific.net/KEM.259-260.466

Paper Titles

High-Speed Milling of Cast Iron with Ceramic and PCBN Tools
p.446

Cutting Forces in High-Speed Milling of a Close Alpha Titanium Alloy
p.451

The Stress Wave Propagation and Crack Formation in Vibratory Metal Cutting Process
p.456

The Impact of Tool Materials and Cutting Parameters on Surface Roughness in High-Speed Face-Milling
p.462

Approach of Realizing Material Removal at Nanometer Level in Ultraprecision Polishing
p.466

Shaping of Green Ceramic Balls and Precision Lapping of Ceramic Balls for Ceramic Ball Bearings
p.471

Study on Eliminating Mechanism of Surface Metal in Nano-Polishing Process
p.476

Change of Residual Stress after Grinding Al₂O₃ Ceramics
p.481

Effects of Grinding Parameters on Microirregularities of Ground Surface
p.485

HomeKey Engineering MaterialsKey Engineering Materials Vols. 259-260Approach of Realizing Material Removal at...

Approach of Realizing Material Removal at Nanometer Level in Ultraprecision Polishing

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Periodical:

Key Engineering Materials (Volumes 259-260)

Pages:

466-470

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.259-260.466

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Online since:

March 2004

Authors:

X. Shen, M. Chang, Ju Long Yuan, Ping Zhao, Wen Hong Zhao, L.B. Zhang

Keywords:

Length of Polishing Trace, Planarization, Ultra-Precision Polishing, Work-Material Removal

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References

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