Ultrasonic Evaluation of Fatigue Damaging Process of Cu Plates Joined with Sn-3.8wt%Ag-1.2wt%Cu Alloy Solder

Zhe Ming Jin; Hiroshi Kato; Kensuke Kageyama

doi:10.4028/www.scientific.net/KEM.270-273.1189

Paper Titles

Particle Erosion of Aged HK40 Steel
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A Study on Fatigue Behavior at Pre-Crack Tip under Mixed-Mode Single Overloading (In the Case of Using the C-Scan Method)
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Evaluation of Material Degradation Using Electrical Resistivity Methods
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Multiaxial Fatigue Life Prediction of Duplex Stainless Steels with Thermal Aging at 430°C under Axial-Torsional Load
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Ultrasonic Evaluation of Fatigue Damaging Process of Cu Plates Joined with Sn-3.8wt%Ag-1.2wt%Cu Alloy Solder
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Finding the Degradation of Insulation Oil in a Transformer with a Fiber-Optic Sensor
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Numerical Analysis of Adhesive Thickness Effect on Fracture Toughness in Adhesive-Bonded Joints
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Ultrasonic Evaluation of Fatigue Damaging Process of Cu Plates Joined with Sn-3.8wt%Ag-1.2wt%Cu Alloy Solder

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Key Engineering Materials (Volumes 270-273)

Pages:

1189-1195

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.270-273.1189

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Online since:

August 2004

Authors:

Zhe Ming Jin, Hiroshi Kato, Kensuke Kageyama

Keywords:

Diffusion Bonding (DB), Multivariate Analysis, Ultrasonic Measurement

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References

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