[1]
P. L. Tu, Y. C. Chan and J. K. L. Lai: IEEE Trans. Compon., Packag. Manuf. Technol. B Adv. Packag., 1997, 20, 87-93.
Google Scholar
[2]
D. P. Yao and J. K. Shang: Metall. Mater. Trans. A, 1995, 26A, 2677-2685.
Google Scholar
[3]
J. K. Shang and D. P. Yao: Proc. ASME Int. Mechanical Engineering Cong. Expo., San Francisco, CA, November 1995, ASME, 1-6.
Google Scholar
[4]
H. Kato, S. Horikawa, and K. Kageyama. Materials Science and Technology, October 1999 Vol. 15, 851-856.
Google Scholar
[5]
H. Kato, T. Masaki, and K. Kageyama. Materials Science and Technology, October 2001 Vol. 17, 1306-1312.
Google Scholar
[6]
H. Kato, K. Matsubara and K. Kageyama. Materials Science and Technology, October 2003 Vol. 19.
Google Scholar