Ultrasonic Evaluation of Fatigue Damaging Process of Cu Plates Joined with Sn-3.8wt%Ag-1.2wt%Cu Alloy Solder

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Key Engineering Materials (Volumes 270-273)

Edited by:

Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee

Pages:

1189-1195

Citation:

Z. M. Jin et al., "Ultrasonic Evaluation of Fatigue Damaging Process of Cu Plates Joined with Sn-3.8wt%Ag-1.2wt%Cu Alloy Solder ", Key Engineering Materials, Vols. 270-273, pp. 1189-1195, 2004

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August 2004

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