Numerical Analysis of Adhesive Thickness Effect on Fracture Toughness in Adhesive-Bonded Joints

Jun Yong Choi; Hyo Jin Kim; Jae Kyoo Lim; Yiu Wing Mai

doi:10.4028/www.scientific.net/KEM.270-273.1200

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Numerical Analysis of Adhesive Thickness Effect on Fracture Toughness in Adhesive-Bonded Joints

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Key Engineering Materials (Volumes 270-273)

Pages:

1200-1205

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.270-273.1200

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Online since:

August 2004

Authors:

Jun Yong Choi, Hyo Jin Kim, Jae Kyoo Lim, Yiu Wing Mai

Keywords:

Adhesive Joint, Adhesive Thickness, Finite Element Analysis (FEA), Fracture Toughness

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References

[1] C. Yan, Y.W. Mai, Q. Yuan, L. Ye, J. Sun: J. Mech. Sci. Vol. 43 (2001), pp.2091-2102.

Google Scholar

[2] D.J. Hunston, A.J. Kinloch, S.S. Wang: J. Adhesion Vol. 28 (1989), pp.103-114.

Google Scholar

[3] A.J. Kinloch, S.J. Shaw: J. Adhesion Vol. 12 (1981), pp.59-77.

Google Scholar

[4] H. Chai, Int. J. Fract: Vol. 60 (1993), pp.311-326.

Google Scholar

[5] C. Yan, Y.W. Mai and L. Ye: J. Adhesion Vol. 72 (2000), pp.27-46.

Google Scholar

[6] M.L. Williams: J. Appl. Mech. -T. ASME 24 (1957), pp.111-1114.

Google Scholar