Paper Titles

Application of the ESPI Method for Thermal Friction Noise in Rear Cover of TV
p.837

Interfacial Stresses in Viscoelastic Thin Layer due to Moisture Absorption
p.843

Nondestructive and Destructive Characterization of Nano-Structured Multilayer
p.849

Measurement of Monodisperse Particle Charge in DC Plasma
p.855

Design of Vertical Type Thermal CVD Reactor with Rotating-Disk for New Generation Semiconductor Processes
p.860

Fabrication of Nano-Structure by STM Tip Induced Atomic Diffusion
p.866

Characterization of Heating Elements with Cobalt Silicide Films for Inkjet Printer
p.872

Transparent Conducting ZnO Films on Polymer Substrates by Pulsed Laser Deposition
p.878

Diagnosis and Reduction of Robot Arm Vibration for 12-Inch Wafer Spin Scrubber
p.884

HomeKey Engineering MaterialsKey Engineering Materials Vols. 270-273Design of Vertical Type Thermal CVD Reactor with...

Design of Vertical Type Thermal CVD Reactor with Rotating-Disk for New Generation Semiconductor Processes

Article Preview

Abstract:

You might also be interested in these eBooks

Advances in Nondestructive Evaluation

Info:

Periodical:

Key Engineering Materials (Volumes 270-273)

Pages:

860-865

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.270-273.860

Citation:

Cite this paper

Online since:

August 2004

Authors:

Hee Joon Kim, Akira Yoshida, Seong Bong Lee, Kwang Sun Kim

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2004 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: