Elastoplastic Singular Behavior of Residual Stress in Si3N4/S45C Joint with Copper Interlayer

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Periodical:

Key Engineering Materials (Volumes 274-276)

Edited by:

W.P. Shen and J.Q. Xu

Pages:

1011-1016

DOI:

10.4028/www.scientific.net/KEM.274-276.1011

Citation:

L. D. Fu et al., "Elastoplastic Singular Behavior of Residual Stress in Si3N4/S45C Joint with Copper Interlayer ", Key Engineering Materials, Vols. 274-276, pp. 1011-1016, 2004

Online since:

October 2004

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$35.00

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