Elastoplastic Singular Behavior of Residual Stress in Si3N4/S45C Joint with Copper Interlayer

Lie Dong Fu; Yukio Miyashita; Yoshiharu Mutoh

doi:10.4028/www.scientific.net/KEM.274-276.1011

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Elastoplastic Singular Behavior of Residual Stress in Si₃N₄/S45C Joint with Copper Interlayer

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Key Engineering Materials (Volumes 274-276)

Pages:

1011-1016

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.274-276.1011

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Online since:

October 2004

Authors:

Lie Dong Fu, Yukio Miyashita, Yoshiharu Mutoh

Keywords:

Ceramic/Metal Joint, Elasto-Plastic Analysis, Interface, Residual Stress, Singularity

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