[1]
J. Susini, D. Pauschinger, R. Geyl, J. -J. Ferme, G. Vieux: Hard X-ray mirror fabrication capabilities in Europe, Optical Engineering, 34, 2 (1995) 388-395.
DOI: 10.1117/12.194836
Google Scholar
[2]
Ohmori H., and Nakagawa T.: Mirror Surface Grinding of Silicon Wafer with Electrolytic In-process Dressing, Annals of the CIRP, 39-1(1990), 329-332.
DOI: 10.1016/s0007-8506(07)61065-8
Google Scholar
[3]
H. Ohmori: Electrolytic in-process dressing (ELID) grinding technique for ultraprecision mirror surface machining, International Journal of the Japan Society for Precision Engineering, 26, 4 (1992) 273-278.
DOI: 10.2493/jjspe.59.1451
Google Scholar
[4]
Ohmori H., and Nakagawa T.: Analysis of Mirror Surface Generation of Hard and Brittle Materials by ELID (Electrolytic In-Process Dressing) Grinding with Superfine Grain Metallic Bond Wheels, Annals of the CIRP, 44-1 (1995), 287-290.
DOI: 10.1016/s0007-8506(07)62327-0
Google Scholar
[5]
H. Ohmori, Y. Yamagata, S. Moriyasu, S. Morita, and W. Lin: Development of Large Ultraprecision Grinding System with ELID for Aspheric Optical Elements and Components, 9th International Conference on Production Engineering, Osaka, Japan, (August 29-September 1, 1999) 147-152.
DOI: 10.1142/9789812817822_0020
Google Scholar
[6]
S. Moriyasu, Y. Yamagata, H. Ohmori, W. Lin, A. Makinouchi, J. Kato, and I. Yamaguchi: Development of On-machine Profile Measuring System with Contact-type Probe, 105 Initiatives of Precision Engineering at the Beginning of a Millennium, (2001).
DOI: 10.1007/0-306-47000-4_116
Google Scholar
[7]
S. Moriyasu, W. Lin, Y. Yamagata, H. Ohmori, and A. Makinouchi: Development of Ultraprecision Vertical-Type Contact-Probe for On-Machine Form Measurement, The 3rd International Symposium on Advances in Abrasive Technology (ISAAT2000), Hawaii, America, (October 30-November 2, 2000) 309-312.
DOI: 10.1142/9789812817822_0026
Google Scholar
[8]
H. Ohmori, Y. Watanabe, W. Lin, K. Katahira and T. Suzuki: An Ultraprecision On-Machine Measurement System, Proceedings of The Sixth International Symposium on Measurement Technology and Intelligent Instruments (ISMTII 2003), Hongkong, China, Nov. 28-Dec. 1, (2003).
Google Scholar