An Experimental Study on Creep Deformation of PBX with Laser Moiré Interferometry Method

Hui Min Xie; Hang Shi; Peng Wan Chen; Feng Lei Huang; Dai Ning Fang

doi:10.4028/www.scientific.net/KEM.306-308.1037

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 306-308An Experimental Study on Creep Deformation of PBX...

An Experimental Study on Creep Deformation of PBX with Laser Moiré Interferometry Method

Abstract:

In this paper, the creep deformation of PBX was measured using the moiré interferometry. The experimental results show a different creep process compared with pure high polymer and this phenomenon is preliminary analyzed from damage mechanics.

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Key Engineering Materials (Volumes 306-308)

Pages:

1037-1042

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.306-308.1037

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Online since:

March 2006

Authors:

Hui Min Xie, Hang Shi, Peng Wan Chen, Feng Lei Huang, Dai Ning Fang

Keywords:

Creep, Creep Damage, Diametric Disk Test, Moiré Interferometry

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References

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