Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging

Abstract:

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue life of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear bi-thermal analysis was conducted and the result was compared with Moire interferometer result to verify FEM results. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. Approximately, 700 cycles have been expected under current conditions (JEDEC standard No. 22-A104)

• Periodical: Key Engineering Materials (Volumes 306-308)
• Pages: 1049-1054
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.306-308.1049
• Online since: March 2006
• Authors: Hyun Wook Nam
• Keywords: ACF, Fatigue Life Prediction, Flip Chip, Packaging, Thermal Fatigue

References

[1] S.B. Lee, KSME Journal, ISSN 1226-7287 Vol. 43, No. 8 (2003), p.38~39.

[2] M.J. Yim and K.W. Paik, IEEE Trans. on components, packaging, and manufacturing tech. Part A, Vol. 21, No. 2 (1998).

[3] T.K. Hwang, S.J. Han and S.B. Lee, Int'l Symp on Electronic Materials & Packaging, (2000) p.358~363.

[4] K.N. Chiang, C.W. Chang, and J.D. Lin, Electronic Packaging Technology Conference, (2000) p.110~116.

[5] Z. Qian, M. Lu, W. Ren and S. Lin, Electronic Packaging Technology Conference, (1999) p.141~148.

[6] Alex Gladkov and Avram Bar-Cohen, IEEE Trans. on Components and Packaging Techonoogy, Vol. 22, No. 2 (1999), p.200~208.