Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging

Abstract:

Thermal fatigue performance and creep resistance of soldered connections are crucial to the integrity and reliability of microelectronics, optoelectronics and photonics packaging systems. In this work, creep and thermal fatigue behaviours of lap shear joints soldered by a tin-based nanocomposite solder were characterized at different temperatures, with a comparison to a traditional Sn60Pb40 solder. The results show that the nano-composite solder has much better creep resistance and thermal creep fatigue property than the Sn60Pb40 solder. This is mainly due to the uniformly dispersed nano-sized Ag particles that have provided effective impediment to dislocation movement and grain boundary sliding, in addition to the alloying effect. The creep fractography analysis by SEM shows that a progressive shear deformation occurred as the main creep fracture mechanism. Sn60Pb solder joints deform dominantly by transgranular sliding, while the nano-composite solder joints creep by intergranular mechanism through grain boundary sliding and voids growth.

• Periodical: Key Engineering Materials (Volume 312)
• Pages: 237-242
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.312.237
• Online since: June 2006
• Authors: Xiao Ping Zhang, C.S.H. Lim, Yiu Wing Mai, Yao Wu Shi
• Keywords: Creep Resistance, Fracture, Nanocomposite Solder, Thermal Fatigue, Tin-Lead Solder

References

[1] W.J. Plumbridge: Journal of Materials Science Vol. 31 (1996), p.2501.

[2] D. Shangguan and G. Gao: Soldering and Surface Mount Technology Vol. 26 (1997), p . 5.

[3] F. Hua and J. Glazer: Design and Reliability of Solder Interconnections, Mahidhara, R K, Frear, D R, Sastry, S M L et al. Eds. (MMMS, Pennsylvania, USA, 1997), p.65.

[4] B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters and P. Cusack: Report, (Department of Trade & Industry, UK, 1999), p.1.

[5] L. Dorn, F. Herbert and S. Shrestha: Proceedings of System Integration in Micro Electronics, Exhibitions & Conference, Nuernberg, Germany, 27-29 July 2000, p.349.

[6] E. Bradley and J. Hranisavljevic: IEEE Transactions on Electronic Packaging Manufacturing Vol. 24 (2001), p.255.

[7] Z.G. Chen, Y.W. Shi and Z.D. Xia: Journal of Electronic Materials Vol. 31 (2002), p.1122.

[8] K.N. Tu, A.M. Gusak and M. Li: Journal of Applied Physics Vol. 93 (2003), p.1335.

[9] X.P. Zhang, H.W. Wang and Y.W. Shi: Journal of Materials Science: Materials in Electronics Vol. 15 (2004), p.511.

[10] Y.W. Shi: China-European Union Workshop on Materials Strategy for New Millenium, Beijing, China, 8 Dec. 2000, p.39.

[11] G. Elger, M. Hutter, H. Oppermann, R. Aschenbrenner, H. Reichl and E. Jaeger: Microsystem Technologies Vol. 7 (2002), p.239.