Influence of Ultrasound Power on the Formation of Submicron Etch Pits during Sonoelectrochemical Etching of Aluminum

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Ultrasound was superimposed during electrochemical etching of aluminum and the effect of ultrasonic power on the formation and growth of etch pits were analyzed with the measurement of fast potential transient and morphology study. Ultrasound contributed the increase of etch pit density by prohibiting anodic oxide film formation and induced uniform tunnel length distribution. Current step reduction experiments indicated the enhanced mass transfer both inside tunnel and bulk solution with the increase of ultrasonic power. The capacitance of etched foil was increased by 40% with 600W of 28 KHz ultrasonic power.

Info:

Periodical:

Key Engineering Materials (Volumes 326-328)

Edited by:

Soon-Bok Lee and Yun-Jae Kim

Pages:

433-436

DOI:

10.4028/www.scientific.net/KEM.326-328.433

Citation:

J. W. Kang et al., "Influence of Ultrasound Power on the Formation of Submicron Etch Pits during Sonoelectrochemical Etching of Aluminum", Key Engineering Materials, Vols. 326-328, pp. 433-436, 2006

Online since:

December 2006

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Price:

$35.00

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