Experimental Mechanics in Nano and Biotechnology

Volumes 326-328

doi: 10.4028/www.scientific.net/KEM.326-328

Paper Title Page

Authors: Jin Haeng Lee, Hyung Yil Lee

Abstract: An indentation method to determine equi-biaxial residual stress is proposed by examining the data from the incremental plasticity theory...

Authors: Ju Young Kim, Jung Suk Lee, Kyung Woo Lee, Kwang Ho Kim, Dong Il Kwon

Abstract: Flow properties and stress state are indispensable factors for safety assessment of structural materials in operation, which were evaluated...

Authors: Joo Young Yoo, Sung Jin Song, Hee Jun Jung, Hyung Ju Yu, Young Hwan Choi, Suk Chull Kang, Dong Hoon Lee

Abstract: Signals acquired from a Combo calibration standard tube used to calibrate for inspection and evaluation of motorized rotating pancake coil...

Authors: Keun Bong Yoo, Hyun Sun Choi, Eui Hyun Kim, Sun Young Cho, Jae Hoon Kim

Abstract: The objective of this study is to estimate the feasibility of X-ray diffraction method application for fatigue life assessment of the...

Authors: Florin Leon, Gabriela Maria Atanasiu, Dan Gâlea

Abstract: Natural hazards, and especially earthquakes, are often recurring phenomena. Therefore, there is a permanent need for solutions to reduce...

Authors: Wei Chung Wang, Shing Chen, Chun Hsien Liu, Chun Yao Ni

Abstract: In the manufacturing process of flip-chips, ultrasonic bonding has been widely used. In the past, however, the ultrasonic horn was designed...

Authors: Sung Han Rhim, Seung Wook Baek, Soo Ik Oh

Abstract: In low temperature co-fired ceramic (LTCC) packaging which offers a good performance to produce multilayer structures with electronic...

Authors: Il Ho Kim, Ji Young Yoon, Soon Bok Lee

Abstract: For measuring deformation of electronic packages, various techniques have been used. Each technique has some merits and demerits. Some...

Authors: Jin Hyoung Park, Chang Kyu Chung, Kyoung Wook Paik, Soon Bok Lee

Abstract: Among many factors that influence the reliability of a flip-chip assembly using NCF interconnections, the most effective parameters are...

Authors: Chang Ming Liu, Chang Chun Lee, Hsiao Tung Ku, Chien Chia Chiu, Kuo Ning Chiang

Abstract: As the interconnection density of electronic packaging continues to increase, the fatigueinduced solder joint failure of surface mounted...


Showing 121 to 130 of 457 Paper Titles