Grinding Characteristics of Boron Doped Diamond Grits Grinding Wheel

Abstract:

Metal and resin bonded diamond wheels were trial manufactured from boron doped diamond grits possessing electrical conductivity and high oxidation temperature. From the results of the investigation on the electro-discharge truing performance, a high truing efficiency along with the possibility of formation of cutting edges on the grits was confirmed. According to the results of the grinding experiment performed using this grinding wheel with flattened abrasive tips, a remarkable improvement in the work surface roughness could be achieved. Furthermore, from the results of the grinding test on cemented carbide and optical glass using the boron doped diamond grits wheel, the grinding ratio was found to increase significantly, whereas the surface roughness improved compared to a conventional diamond grits (similar friability) wheel.

• Periodical: Key Engineering Materials (Volume 329)
• Pages: 477-482
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.329.477
• Online since: January 2007
• Authors: Manabu Iwai, Kiyotaka Nakagawa, Tetsutaro Uematsu, Keizo Takeuchi, Kiyoshi Suzuki
• Keywords: Boron Doped Diamond Grits, Diamond Wheel, Difficult-to-Grind Materials, Electrically Conductive Diamond Grits, Electro-Discharge Truing, Grinding, Wheel Wear

References

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[2] K. Suzuki, M. Iwai, T. Uematsu et al.: Development of a Grinding Wheel with Electrically Conductive Diamond Cutting Edges, Advances in Abrasive Technology VI, Key Engineering Materials Vols. 257-258 (Trans Tech Publications, 2003) pp.239-244.

DOI: 10.4028/www.scientific.net/kem.257-258.239

[3] K. Suzuki, M. Iwai, T. Uematsu et al.: Development of diamond grinding wheel having electrically conductive diamond cutting edges - 1 st report, Journal of JSAT, vol. 49, no. 6 (2005) pp.347-352. (in Japanese).

DOI: 10.4028/www.scientific.net/kem.257-258.239

[4] K. Suzuki, M. Iwai, T. Uematsu et al.: Development of an electrically conductive diamond grits wheel, Proceedings of JSAT conference, ABTEC2004, (2004) pp.487-490. (in Japanese).

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