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Effect of Raw Materials on the Thermal Conductivity and Microstructure of Aluminum Nitride

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Abstract:

High thermal conductivity, along with good electrical and mechanical properties, makes aluminum nitride a very promising material for electronic packaging and substrates. Much work has been reported on the influence of additions and sintering aids on densification and thermal conductivity. In this paper, the influence of raw materials on the sintering behavior and thermal conductivity characteristics of pressureless-sintered AlN has been investigated. The highest thermal conductivity is 248W/m.K.

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Periodical:

Key Engineering Materials (Volumes 336-338)

Pages:

790-792

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.336-338.790

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Online since:

April 2007

Authors:

Zhi Ping Liu, Hong Yu Zheng, Jin Li Zhang, Zheng Guo Jin

Keywords:

Aluminum Nitride (AlN), Raw Material, Thermal Conductivity (TC)

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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