Applications of Polishing Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers

Y.S. Lu; Yasuhiro Tani; K. Soutome; Yasushi Kamimura

doi:10.4028/www.scientific.net/KEM.339.263

Paper Titles

Study on Displacement Self-Sensing of Piezoelectric Actuator
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Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry
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Research on Flow in Microchannels with Lotus Effect Coating by Molecular Dynamics Simulation
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Features of Machine Variables in Thermosonic Flip Chip
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Applications of Polishing Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers
p.263

Dynamic Modeling of Predicting Chip Formation Based on Artificial Neural Networks and Real-Time Simulation of Chip
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Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading
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High Speed Wire Electrical Discharge Machining (HS-WEDM) Phenomena of Insulating Si₃N₄ Ceramics with Assisting Electrode
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A Study of Micro V-Groove Fabrication in Ultra-Precision Freeform Machining
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 339Applications of Polishing Technology Using Polymer...

Applications of Polishing Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers

Abstract:

This paper deals with a novel polishing technology using polymer particles. It has been proposed and developed by the authors for the purpose of solving the problems associated with polishing pads such as pad deterioration, process inconsistency and poor accuracy. Single side polishing of silicon wafers and double side polishing of quartz crystal square wafers were performed to clarify the basic characteristics of the technology. The results showed that appropriate combination of tool plate with polymer particles could greatly improve polishing characteristics. In particular, the edge profiles can be controlled to have desirable shape as well as amplitudes.