Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading

Y.T. Yu; Wei Zheng Yuan; D.Y. Qiao

doi:10.4028/www.scientific.net/KEM.339.276

Paper Titles

Research on Flow in Microchannels with Lotus Effect Coating by Molecular Dynamics Simulation
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Features of Machine Variables in Thermosonic Flip Chip
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Applications of Polishing Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers
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Dynamic Modeling of Predicting Chip Formation Based on Artificial Neural Networks and Real-Time Simulation of Chip
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Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading
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High Speed Wire Electrical Discharge Machining (HS-WEDM) Phenomena of Insulating Si₃N₄ Ceramics with Assisting Electrode
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A Study of Micro V-Groove Fabrication in Ultra-Precision Freeform Machining
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A Novel Micro-Dissection Method Using Ultrasonic Vibration for Molecular Analysis
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Fabrication of Micro Parts with Micro-WEDM
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 339Effects of Imperfections on Bifurcation of...

Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading

Abstract:

Bifurcation of multi-layer microstructures subjected to thermal loading can be harmful for reliability and stability of MEMS structures. In this paper, three imperfections of geometry, coefficient of thermal expansion and thermal loading were introduced to investigate their effects on structural bifurcation by finite element simulation. Results show that bifurcation is strongly influenced by the imperfections. With larger deviation of imperfections, it results in a decreasing temperature to trigger the bifurcation and a gradual beginning of it.