High Speed Wire Electrical Discharge Machining (HS-WEDM) Phenomena of Insulating Si3N4 Ceramics with Assisting Electrode

Yong Feng Guo; Ji Cheng Bai; Guan Qun Deng; Ze Sheng Lu

doi:10.4028/www.scientific.net/KEM.339.281

Paper Titles

Features of Machine Variables in Thermosonic Flip Chip
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Applications of Polishing Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers
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Dynamic Modeling of Predicting Chip Formation Based on Artificial Neural Networks and Real-Time Simulation of Chip
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Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading
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High Speed Wire Electrical Discharge Machining (HS-WEDM) Phenomena of Insulating Si₃N₄ Ceramics with Assisting Electrode
p.281

A Study of Micro V-Groove Fabrication in Ultra-Precision Freeform Machining
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A Novel Micro-Dissection Method Using Ultrasonic Vibration for Molecular Analysis
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Fabrication of Micro Parts with Micro-WEDM
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Experimental Research of On-Line Fabrication of Tool-Electrode Base on Electrochemical Micromachining
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 339High Speed Wire Electrical Discharge Machining...

High Speed Wire Electrical Discharge Machining (HS-WEDM) Phenomena of Insulating Si₃N₄ Ceramics with Assisting Electrode

Abstract:

Advanced engineering ceramics are more and more widely employed in modern industries because of their excellent mechanical properties such as high hardness, high compressive strength, high chemical and abrasive resistance. This paper investigates the high speed wire electrical discharge machining (HS-WEDM) of Si3N4-based ceramics by assisting electrode method. The theory of assisting electrode method is introduced. The machining phenomena under different electrical parameters were studied and the optimized machine pulse width was got. The material removal mechanisms change with the increase in the power of single pulse.

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Periodical:

Key Engineering Materials (Volume 339)

Pages:

281-285

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.339.281

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Online since:

May 2007

Authors:

Yong Feng Guo, Ji Cheng Bai, Guan Qun Deng, Ze Sheng Lu

Keywords:

Assisting Electrode, Conductive Layer, WEDM

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References

[1] T. Tani, Y. Fukuzawa, N. Mohri, N. Saito and M. Okada: Journal of Materials Processing Technology, Vol. 149 (2004), pp.124-128.

DOI: 10.1016/j.jmatprotec.2003.12.027

Google Scholar

[2] N. Mohri, Y. Fukuzawa, T. Tani, N. Saito and K. Furutani: Annals of the CIRP, Vol. 45 (1996) No. 1, pp.201-204.

DOI: 10.1016/s0007-8506(07)63047-9

Google Scholar

[3] N. Mohri, Y. Fukuzawa, T. Tani and T. Sata: Annals of the CIRP, Vol. 51 (2002) No. 1, pp.161-164.

DOI: 10.1016/s0007-8506(07)61490-5

Google Scholar

[4] B. Lauwers, W. Liu, J.P. Kruth, J. Vleugels, D. Jiang and O.V. Biest: International Journal of Electrical Machining, (January, 2005) No. 10, pp.33-37.

Google Scholar

[5] G. Deng: Study of Insulating Ceramics Si3N4 by HS-WEDM (A Dissertation for the Master Degree in Engineering, Harbin Institute of Technology, 2005).

Google Scholar

[6] Y. Fukuzawa, N. Mohri and T. Tani: International Journal of Electrical Machining, (January, 1997) No. 2, pp.25-30.

Google Scholar