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Preface
Progress of Research in Slicing Technology of Large-Scale Silicon Wafers
p.1
p.1
The Analysis on Movement of the Charged Particles in a Magnetic-Electrochemical Compound Polishing
p.6
p.6
Study on Brittle-Ductile Transition Mechanism of Ultra-Precision Turning of Single Crystal Silicon
p.11
p.11
Initiation and Propagation Laws of Glass Cracks in Specimens under the Action of Cylindric Indenter Subjected to Normal Load
p.17
p.17
Large Plastic Deformation and Ultra-Fine Grained Structures Generated by Machining
p.21
p.21
Mechanism of Chip Deformation in Orthogonal Cutting the Wheel Steel
p.26
p.26
The Influence of Tool Edge Radius on Size Effect in Orthogonal Micro-Cutting Process of 7050-T7451 Aluminum Alloy
p.31
p.31
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Abstract:
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Info:
Periodical:
Key Engineering Materials (Volumes 375-376)
Online since:
March 2008
Сopyright:
© 2008 Trans Tech Publications Ltd. All Rights Reserved
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