Study on the Polishing Mechanism of Low Temperature Co-Fired Ceramic for Microsystem Application

Ji Jun Zhu; Ju Long Yuan; Simon S. Ang

doi:10.4028/www.scientific.net/KEM.375-376.47

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Study on the Polishing Mechanism of Low Temperature Co-Fired Ceramic for Microsystem Application
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 375-376Study on the Polishing Mechanism of Low...

Study on the Polishing Mechanism of Low Temperature Co-Fired Ceramic for Microsystem Application

Abstract:

Multilayer ceramics based on the low-temperature co-fired ceramics (LTCC) are gaining increasing interests in the manufacturing of highly-integrated systems for microelectronic and micro-system applications. The polishing experiments of sintered LTCC using a custom-built precision polishing machine are reported in this paper. First, a micro-fluidic distributor was fabricated using LTCC. Then, the polishing of this meso-MEMS system was studied using several polishing parameters. By optimizing the polishing parameters, the surface roughness can be reduced to 4 nm.

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Periodical:

Key Engineering Materials (Volumes 375-376)

Pages:

47-51

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.375-376.47

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Online since:

March 2008

Authors:

Ji Jun Zhu, Ju Long Yuan, Simon S. Ang

Keywords:

Application, LTCC, Micro-Fluidics, Polishing

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